DocumentCode
1906056
Title
Numerical analysis of field coupling to microstrip circuits
Author
Badawi, A. ; Sebak, A.
Author_Institution
Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada
Volume
1
fYear
2002
fDate
2002
Firstpage
307
Lastpage
310
Abstract
Analysis of field coupling and emissions from printed circuit boards (PCBs) is important for assessment of the immunity of the PCB to external radiation. Immunity of electronic systems is now tightly regulated in consumer markets. This paper presents a procedure for the analysis of susceptibility of PCBs. The procedure identifies a finite set of source and field points to increase the efficiency of the numerical testing. Reciprocity is used to decrease the number of external source locations that need to be used in the field coupling analysis through performing a radiation analysis. The numerical analysis of the PCB is performed using the Method of Moments (MoM). Numerical examples for the application of method are included. Further examples of the overall procedure will be presented
Keywords
electromagnetic interference; method of moments; microstrip circuits; printed circuit design; external radiation; field coupling; method of moments; microstrip circuits; numerical testing; printed circuit boards; radiation analysis; reciprocity; susceptibility; Circuit testing; Coupling circuits; Frequency; Impedance; Message-oriented middleware; Microstrip; Moment methods; Numerical analysis; Printed circuits; Transmission line matrix methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical and Computer Engineering, 2002. IEEE CCECE 2002. Canadian Conference on
Conference_Location
Winnipeg, Man.
ISSN
0840-7789
Print_ISBN
0-7803-7514-9
Type
conf
DOI
10.1109/CCECE.2002.1015239
Filename
1015239
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