DocumentCode
1906487
Title
Materials/processing approaches to phase stabilization of thermally conductive pastes
Author
Anderson, H.R., Jr. ; Booth, R.B.
Author_Institution
IBM Corp., Hopewell Junction, NY, USA
fYear
1990
fDate
20-23 May 1990
Firstpage
886
Lastpage
892
Abstract
Previously reported thermally conductive pastes based on simple dispersions of boron nitride particles in mineral oil were observed to undergo phase separation when stressed thermal-mechanically. Such stressing of thermal pastes was carried out to simulate the mechanical shearing action imposed on such pastes as a result of the anticipated differential motion of contacted heat-transfer surfaces and the paste during transient heating/cooling in various cooling assemblies. In the present work, the tendency of thermally conductive pastes to phase-separate during such simulated functional use was eliminated and given attributes of reworkability and corrosion inhibition by a combination of several approaches. These included: (1) the use of surface modification agents such as coupling agents and/or polymers on boron nitride particles: (2) milling conditions employed; and (3) the selection of novel oily and oxidation-resistant vehicle material systems to interact with the modified particle surfaces while preventing corrosion of contacted metallic surfaces
Keywords
conducting materials; corrosion protection; disperse systems; packaging; phase transformations; thermal conductivity of solids; BN particles; contacted heat-transfer surfaces; contacted metallic surfaces; cooling assemblies; corrosion inhibition; coupling agents; differential motion; mechanical shearing action; milling conditions; mineral oil; modified particle surfaces; oxidation-resistant vehicle material systems; phase separation; phase stabilization; polymers; reworkability; simulated functional use; surface modification agents; thermally conductive pastes; transient heating/cooling; Boron; Conducting materials; Cooling; Corrosion; Heating; Minerals; Petroleum; Shearing; Thermal conductivity; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ECTC.1990.122294
Filename
122294
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