DocumentCode :
1906487
Title :
Materials/processing approaches to phase stabilization of thermally conductive pastes
Author :
Anderson, H.R., Jr. ; Booth, R.B.
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
fYear :
1990
fDate :
20-23 May 1990
Firstpage :
886
Lastpage :
892
Abstract :
Previously reported thermally conductive pastes based on simple dispersions of boron nitride particles in mineral oil were observed to undergo phase separation when stressed thermal-mechanically. Such stressing of thermal pastes was carried out to simulate the mechanical shearing action imposed on such pastes as a result of the anticipated differential motion of contacted heat-transfer surfaces and the paste during transient heating/cooling in various cooling assemblies. In the present work, the tendency of thermally conductive pastes to phase-separate during such simulated functional use was eliminated and given attributes of reworkability and corrosion inhibition by a combination of several approaches. These included: (1) the use of surface modification agents such as coupling agents and/or polymers on boron nitride particles: (2) milling conditions employed; and (3) the selection of novel oily and oxidation-resistant vehicle material systems to interact with the modified particle surfaces while preventing corrosion of contacted metallic surfaces
Keywords :
conducting materials; corrosion protection; disperse systems; packaging; phase transformations; thermal conductivity of solids; BN particles; contacted heat-transfer surfaces; contacted metallic surfaces; cooling assemblies; corrosion inhibition; coupling agents; differential motion; mechanical shearing action; milling conditions; mineral oil; modified particle surfaces; oxidation-resistant vehicle material systems; phase separation; phase stabilization; polymers; reworkability; simulated functional use; surface modification agents; thermally conductive pastes; transient heating/cooling; Boron; Conducting materials; Cooling; Corrosion; Heating; Minerals; Petroleum; Shearing; Thermal conductivity; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
Type :
conf
DOI :
10.1109/ECTC.1990.122294
Filename :
122294
Link To Document :
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