• DocumentCode
    1906487
  • Title

    Materials/processing approaches to phase stabilization of thermally conductive pastes

  • Author

    Anderson, H.R., Jr. ; Booth, R.B.

  • Author_Institution
    IBM Corp., Hopewell Junction, NY, USA
  • fYear
    1990
  • fDate
    20-23 May 1990
  • Firstpage
    886
  • Lastpage
    892
  • Abstract
    Previously reported thermally conductive pastes based on simple dispersions of boron nitride particles in mineral oil were observed to undergo phase separation when stressed thermal-mechanically. Such stressing of thermal pastes was carried out to simulate the mechanical shearing action imposed on such pastes as a result of the anticipated differential motion of contacted heat-transfer surfaces and the paste during transient heating/cooling in various cooling assemblies. In the present work, the tendency of thermally conductive pastes to phase-separate during such simulated functional use was eliminated and given attributes of reworkability and corrosion inhibition by a combination of several approaches. These included: (1) the use of surface modification agents such as coupling agents and/or polymers on boron nitride particles: (2) milling conditions employed; and (3) the selection of novel oily and oxidation-resistant vehicle material systems to interact with the modified particle surfaces while preventing corrosion of contacted metallic surfaces
  • Keywords
    conducting materials; corrosion protection; disperse systems; packaging; phase transformations; thermal conductivity of solids; BN particles; contacted heat-transfer surfaces; contacted metallic surfaces; cooling assemblies; corrosion inhibition; coupling agents; differential motion; mechanical shearing action; milling conditions; mineral oil; modified particle surfaces; oxidation-resistant vehicle material systems; phase separation; phase stabilization; polymers; reworkability; simulated functional use; surface modification agents; thermally conductive pastes; transient heating/cooling; Boron; Conducting materials; Cooling; Corrosion; Heating; Minerals; Petroleum; Shearing; Thermal conductivity; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1990. ., 40th
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ECTC.1990.122294
  • Filename
    122294