DocumentCode
1906678
Title
Improved Shallow Trench Isolation For Sub-Halfmicron CMOS
Author
Cabanal, J.P. ; Haond, M.
Author_Institution
CNET, Chemin du Vieux Chêne, BP 98, 38243 MEYLAN Cedex, FRANCE
fYear
1991
fDate
16-19 Sept. 1991
Firstpage
651
Lastpage
654
Abstract
This paper presents new results on shallow trench isolation with the use of tilted field implants for avoiding the field parasitic transistors. Isolation results and gate oxide breakdown voltage are presented and discussed. The fabrication of 0.7 ¿m DLM 16K SRAMs with this type of isolation has been demonstrated with results similar to standard isolation circuits.
Keywords
CMOS process; Circuits; Design engineering; Etching; MOS devices; MOSFETs; Microelectronic implants; Resists; Standards publication; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1991. ESSDERC '91. 21st European
Conference_Location
Montreux, Switzerland
Print_ISBN
0444890661
Type
conf
Filename
5435252
Link To Document