Title :
MEMS technology: optical application, medical application and SOC application
Author_Institution :
New Ind. Creation Hatchery Center (NICHe), Tohoku Univ., Sendai, Japan
Abstract :
MEMS (micro electromechanical systems) have been developed based on silicon bulk micromachining. Wafer process packaging was applied to an electrostatically levitated rotational gyroscope and a micro relay. High density electrical feedthrough made by glass deep RIE and metal electroplating enabled an array MEMS as multiprobe data storage and contactor for LSI probing. Fine diameter fiber optic sensors for pressure and NSOM (near field scanning optical microscope) sensor applications were developed. The hydrogen storage capacity of a carbon nanotube was measured using the resonant frequency shift of a thin silicon cantilever.
Keywords :
biological techniques; biomedical equipment; blood pressure measurement; carbon nanotubes; electric sensing devices; fibre optic sensors; gyroscopes; integrated circuit testing; large scale integration; microactuators; micromachining; micromechanical resonators; microsensors; optical microscopy; plasma materials processing; pressure sensors; relays; semiconductor device packaging; sputter etching; C; H/sub 2/; LSI probing; MEMS technology; NSOM probe; Si; SoC application; array MEMS contactor; array MEMS multiprobe data storage; carbon nanotube; electrostatically levitated rotational gyroscope; fiber optic blood vessel pressure sensor; fiber optic sensors; glass deep RIE; high density electrical feedthrough; hydrogen storage capacity; medical application; metal electroplating; micro electromechanical systems; micro relay; near field scanning optical microscope; optical application; pressure sensors; resonant frequency shift; silicon bulk micromachining; thin silicon cantilever; wafer process packaging; Biomedical equipment; Biomedical optical imaging; Electromechanical systems; Medical services; Micromachining; Micromechanical devices; Optical fiber sensors; Optical microscopy; Optical sensors; Silicon;
Conference_Titel :
VLSI Technology, 2002. Digest of Technical Papers. 2002 Symposium on
Conference_Location :
Honolulu, HI, USA
Print_ISBN :
0-7803-7312-X
DOI :
10.1109/VLSIT.2002.1015366
