DocumentCode :
1907999
Title :
Silicon Micromachining for Sensor Applications
Author :
Rudolf, F. ; Bergqvist, J.
Author_Institution :
CSEM - CENTRE SUISSE D´´ELECTRONIQUE ET DE MICROTECHNIQUE S.A., 2007 NEUCHÃ\x82TEL, SWITZERLAND
fYear :
1991
fDate :
16-19 Sept. 1991
Firstpage :
399
Lastpage :
406
Abstract :
The capacitive silicon sensor technology is an example of how silicon micromachining can be applied to a family of sensors. Absolute pressure sensors, accelerometers, and microphones can be fabricated with basically the same technology. Its main elements are standard IC processing, silicon etching, and wafer bonding. Placed in a suitable microsystem development environment, bulk silicon micromachining is still a key technology for new and low cost sensors and actuators.
Keywords :
Capacitive sensors; Capacitors; Chemical sensors; Electrodes; Etching; Glass; Machining; Micromachining; Silicon; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1991. ESSDERC '91. 21st European
Conference_Location :
Montreux, Switzerland
Print_ISBN :
0444890661
Type :
conf
Filename :
5435304
Link To Document :
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