EMI modeling and simulation in the IC design process

Author

Steinecke, Thomas ; Hesidenz, Dirk ; Miersch, Ekkehard

Author_Institution

Infineon Technol. AG, Munich

fYear

2006

fDate

Feb. 27 2006-March 3 2006

Firstpage

594

Lastpage

597

Abstract

The power integrity of the system chip plus chip package determines the RF emission potential and is thus a key quality parameter of complex integrated circuits like microcontrollers for automotive applications. However, modeling and simulation of power integrity and thus electromagnetic emission must be applied as early as possible in the IC design process. This paper presents two approaches: (1) the case study simulation in a very early IC design phase and (2) the accurate netlist/layout-based simulation at a later design phase. Both implementations have been used in combination with the Infineon 32-bit microcontroller TC1796

Keywords

electromagnetic interference; integrated circuit layout; interference suppression; system-in-package; system-on-chip; EMI modeling; IC design process; RF emission potential; chip package; electromagnetic emission; layout-based simulation; power integrity; system chip; Application specific integrated circuits; Circuit simulation; Electromagnetic interference; Integrated circuit modeling; Integrated circuit packaging; Microcontrollers; Power system modeling; Process design; Radio frequency; Radiofrequency integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2006. EMC-Zurich 2006. 17th International Zurich Symposium on

Conference_Location

Singapore

Print_ISBN

3-9522990-3-0

Type

conf

DOI

10.1109/EMCZUR.2006.215004

Filename

1629694