Title :
EMI modeling and simulation in the IC design process
Author :
Steinecke, Thomas ; Hesidenz, Dirk ; Miersch, Ekkehard
Author_Institution :
Infineon Technol. AG, Munich
fDate :
Feb. 27 2006-March 3 2006
Abstract :
The power integrity of the system chip plus chip package determines the RF emission potential and is thus a key quality parameter of complex integrated circuits like microcontrollers for automotive applications. However, modeling and simulation of power integrity and thus electromagnetic emission must be applied as early as possible in the IC design process. This paper presents two approaches: (1) the case study simulation in a very early IC design phase and (2) the accurate netlist/layout-based simulation at a later design phase. Both implementations have been used in combination with the Infineon 32-bit microcontroller TC1796
Keywords :
electromagnetic interference; integrated circuit layout; interference suppression; system-in-package; system-on-chip; EMI modeling; IC design process; RF emission potential; chip package; electromagnetic emission; layout-based simulation; power integrity; system chip; Application specific integrated circuits; Circuit simulation; Electromagnetic interference; Integrated circuit modeling; Integrated circuit packaging; Microcontrollers; Power system modeling; Process design; Radio frequency; Radiofrequency integrated circuits;
Conference_Titel :
Electromagnetic Compatibility, 2006. EMC-Zurich 2006. 17th International Zurich Symposium on
Conference_Location :
Singapore
Print_ISBN :
3-9522990-3-0
DOI :
10.1109/EMCZUR.2006.215004