Title :
The 3-D IC with 4-layer Structure for the Fast Range Sensing System
Author :
Akasaka, Y. ; Inoue, Y. ; Nakaya, M. ; Nishimura, T.
Author_Institution :
LSI Laboratory, Mitsubishi Electric Corp., 4-1 Mizuhara Itami 664 Japan
Abstract :
The 4-layer 3-D IC with having image sensing and its signal processing capabilities is newly designed and fabricated. Fundamental operation of each circuit is confirmed in a 4-layer device structure. It is also indicated from the circuit evaluations that about 30 times faster signal processing will be achieved in the case of the chip being applied for the fast range sensing system, than in the convensional system.
Keywords :
Application specific integrated circuits; CMOS image sensors; CMOS integrated circuits; CMOS logic circuits; Image converters; MOS devices; Sensor arrays; Signal design; Signal processing; Three-dimensional integrated circuits;
Conference_Titel :
Solid State Device Research Conference, 1991. ESSDERC '91. 21st European
Conference_Location :
Montreux, Switzerland
