DocumentCode
1909203
Title
Results of the three-dimensional integrated circuits project in Japan
Author
Moriya, Tetsuo ; Watanabe, Tsukasa ; Nakano, Isao ; Maeda, Shuku
Author_Institution
Research and Development Association for Future Electron Devices, Fukide Building No.2, 4-1-21 Toranomon, Minato-ku, Tokyo 105, Japan
fYear
1991
fDate
16-19 Sept. 1991
Firstpage
167
Lastpage
174
Abstract
As the main theme of the Japanese national projects, the Three-Dimensional Integrated Circuits Project was initiated in 1981 to develop the most significant basic technology which is indispensable to the establishment of electronics and related industries for the next generation. This project was completed in 1991. The research and development were advanced by the collaboration of Electrotechnical Laboratory and seven private companies. The outline and noteworthy results of the project will be described in the following section.
Keywords
Bonding; CMOS technology; Fabrication; Gold; Integrated circuit technology; MOSFET circuits; Research and development; Substrates; Three-dimensional integrated circuits; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1991. ESSDERC '91. 21st European
Conference_Location
Montreux, Switzerland
Print_ISBN
0444890661
Type
conf
Filename
5435350
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