Title :
Results of the three-dimensional integrated circuits project in Japan
Author :
Moriya, Tetsuo ; Watanabe, Tsukasa ; Nakano, Isao ; Maeda, Shuku
Author_Institution :
Research and Development Association for Future Electron Devices, Fukide Building No.2, 4-1-21 Toranomon, Minato-ku, Tokyo 105, Japan
Abstract :
As the main theme of the Japanese national projects, the Three-Dimensional Integrated Circuits Project was initiated in 1981 to develop the most significant basic technology which is indispensable to the establishment of electronics and related industries for the next generation. This project was completed in 1991. The research and development were advanced by the collaboration of Electrotechnical Laboratory and seven private companies. The outline and noteworthy results of the project will be described in the following section.
Keywords :
Bonding; CMOS technology; Fabrication; Gold; Integrated circuit technology; MOSFET circuits; Research and development; Substrates; Three-dimensional integrated circuits; Wiring;
Conference_Titel :
Solid State Device Research Conference, 1991. ESSDERC '91. 21st European
Conference_Location :
Montreux, Switzerland
