SPICE model for mechanically stressed device/circuit simulation

Author

Maier, C. ; Steiner, R. ; Mayer, M. ; Vogt, R. ; Baltes, H.

Author_Institution

Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland

Volume

6

fYear

1998

fDate

31 May-3 Jun 1998

Firstpage

405

Abstract

We present a SPICE-compatible circuit model to predict the effects of mechanical stress on the electrical characteristics of devices and integrated circuits (ICs). The model is assembled from unit cells, which consist of resistors and voltage controlled current sources. We verified the circuit model with measurements on an n-well magnetic sensor structure on (100) silicon. The model predicts the influence of stress to less than 10% discrepancy from measurement

Keywords

SPICE; circuit analysis computing; equivalent circuits; integrated circuit modelling; semiconductor device models; stress effects; (100) silicon substrate; SPICE model; Si; circuit model; electrical characteristics; integrated circuits; mechanically stressed circuit simulation; mechanically stressed device simulation; n-well magnetic sensor structure; voltage controlled current sources; Assembly; Circuit simulation; Electric variables; Integrated circuit measurements; Integrated circuit modeling; Predictive models; Resistors; SPICE; Stress; Voltage control;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 1998. ISCAS '98. Proceedings of the 1998 IEEE International Symposium on

Conference_Location

Monterey, CA

Print_ISBN

0-7803-4455-3

Type

conf

DOI

10.1109/ISCAS.1998.705296

Filename

705296