Title :
Finite Element Analysis of Stress Distributions in Interconnect Structures
Author :
Coughlan, J. ; Foley, S. ; Mathewson, A.
Author_Institution :
National Microelectronics Research Centre, Ireland
fDate :
22-24 September 1997
Keywords :
Adhesives; Delamination; Dielectric materials; Electromigration; Failure analysis; Finite element methods; Plugs; Silicon; Tensile stress; Thermal stresses;
Conference_Titel :
Solid-State Device Research Conference, 1997. Proceeding of the 27th European
Print_ISBN :
2-86332-221-4
DOI :
10.1109/ESSDERC.1997.194463
