DocumentCode
1910495
Title
Electro-Thermal Interaction on Circuit Level under the Influence of Packaging
Author
Digele, G. ; Lindenkreuz, S. ; Kasper, E.
Author_Institution
Robert Bosch GmbH, Germany and University of Stuttgart, Germany
fYear
1997
fDate
22-24 September 1997
Firstpage
460
Lastpage
463
Keywords
Circuit simulation; Coupling circuits; Electrothermal effects; Nonlinear equations; Resistance heating; Semiconductor device packaging; Silicon; Temperature dependence; Temperature sensors; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference, 1997. Proceeding of the 27th European
Print_ISBN
2-86332-221-4
Type
conf
DOI
10.1109/ESSDERC.1997.194465
Filename
1503395
Link To Document