• DocumentCode
    1910525
  • Title

    The effects of substrate coupling on triggering uniformity and ESD failure threshold of fully silicided NMOS transistors

  • Author

    Huh, Y.J. ; Axerad, V. ; Chen, J.-W. ; Bendix, P.

  • Author_Institution
    Device Technol. Gr, LSI Logic Corp., Milpitas, CA, USA
  • fYear
    2002
  • fDate
    11-13 June 2002
  • Firstpage
    220
  • Lastpage
    221
  • Abstract
    We present a multi-finger turn-on model incorporating substrate coupling effects in multi-finger NMOS transistors during ESD events. It is demonstrated that the substrate coupling enables uniform triggering in a multi-finger structure. In addition, we show that fully silicided transistors can be used successfully as an ESD protection device without any design/process options if the effective epi thickness is larger than 1.5 /spl mu/m or bulk wafer is used.
  • Keywords
    MOSFET; electrostatic discharge; failure analysis; semiconductor device models; semiconductor device reliability; 1.5 micron; ESD failure threshold; bulk wafer; design/process options; epi thickness; fully silicided NMOS transistors; multi-finger turn-on model; protection device; substrate coupling; triggering uniformity; uniform triggering; Breakdown voltage; Delay effects; Doping; Electrostatic discharge; Fingers; Large scale integration; Logic devices; MOS devices; MOSFETs; Protection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 2002. Digest of Technical Papers. 2002 Symposium on
  • Conference_Location
    Honolulu, HI, USA
  • Print_ISBN
    0-7803-7312-X
  • Type

    conf

  • DOI
    10.1109/VLSIT.2002.1015461
  • Filename
    1015461