Three-Dimensional Simulation of Contact Hole Metallization using Aluminum Sputter Deposition at Elevated Temperatures

Author

Bear, E. ; Lorenz, J. ; Ryssel, H.

Author_Institution

Universit¨at Erlangen-N¨urnberg, Germany

fYear

1997

fDate

22-24 September 1997

Firstpage

476

Lastpage

479

Keywords

Aluminum; Atomic layer deposition; Circuit simulation; Electronic mail; Equations; Geometry; Metallization; Solid modeling; Sputtering; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Device Research Conference, 1997. Proceeding of the 27th European

Print_ISBN

2-86332-221-4

Type

DOI

10.1109/ESSDERC.1997.194469

Filename

1503399

Link To Document