Title :
Three-Dimensional Simulation of Contact Hole Metallization using Aluminum Sputter Deposition at Elevated Temperatures
Author :
Bear, E. ; Lorenz, J. ; Ryssel, H.
Author_Institution :
Universit¨at Erlangen-N¨urnberg, Germany
fDate :
22-24 September 1997
Keywords :
Aluminum; Atomic layer deposition; Circuit simulation; Electronic mail; Equations; Geometry; Metallization; Solid modeling; Sputtering; Temperature;
Conference_Titel :
Solid-State Device Research Conference, 1997. Proceeding of the 27th European
Print_ISBN :
2-86332-221-4
DOI :
10.1109/ESSDERC.1997.194469
