DocumentCode :
1911427
Title :
Manufacturing large diameter GaAs substrates for epitaxial devices by VB method
Author :
Nakai, R. ; Hagi, Y. ; Kawarabayashi, S. ; Miyajima, Hiroki ; Toyoda, N. ; Kiyama, M. ; Sawada, S. ; Kuwata, N. ; Nakajima, S.
Author_Institution :
Sumitomo Electr. Ind. Ltd., Hyogo, Japan
fYear :
1998
fDate :
1-4 Nov. 1998
Firstpage :
243
Lastpage :
246
Abstract :
The vertical boat (VB) method has advantages in the growth of substrates for epitaxial devices. Low residual strain and low dislocation four inch GaAs crystals are manufactured with good reproducibility. Low residual strain reduces slip line occurrence and low dislocation density enables growth of low defects in epitaxial layers. FETs fabricated on carbon doped high resistivity VB substrates show high breakdown voltage. Vth was stable at higher drain voltages. Six inch GaAs crystals are also grown by VB and show adequate characteristics.
Keywords :
III-V semiconductors; crystal growth from melt; dislocation density; gallium arsenide; integrated circuit manufacture; semiconductor device manufacture; semiconductor epitaxial layers; semiconductor growth; substrates; 4 in; 6 in; C doped high resistivity substrates; FETs; GaAs; GaAs crystals; GaAs:C; IC manufacture; VB method; epitaxial devices; high breakdown voltage; large diameter GaAs substrates; low dislocation; low residual strain; reproducibility; threshold voltage stabilty; vertical boat method; Boats; Capacitive sensors; Conductivity; Crystals; Epitaxial layers; FETs; Gallium arsenide; Manufacturing; Reproducibility of results; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1998. Technical Digest 1998., 20th Annual
Conference_Location :
Atlanta, GA, USA
ISSN :
1064-7775
Print_ISBN :
0-7803-5049-9
Type :
conf
DOI :
10.1109/GAAS.1998.722686
Filename :
722686
Link To Document :
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