• DocumentCode
    1911673
  • Title

    Implementation experience of automated guided vehicle system in an IC foundry fab around SMIF environment

  • Author

    Yang, Tseng-Hsiang ; Lin, Li-Ren ; Hsu, Kuo-Hsiang ; Chen, Thomas

  • Author_Institution
    Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan
  • fYear
    1998
  • fDate
    16-17 Jun 1998
  • Firstpage
    182
  • Lastpage
    186
  • Abstract
    Taiwan Semiconductor Manufacturing Company (TSMC) is a pure foundry fab designed around SMIF environment. To shorten the learning curve of fully automated transfer system for 12" wafer fab, we installed a pilot intrabay system using automated guided vehicles system (AGVS) in TSMC photo area. It is challenging to implement fully automated system in an IC foundry fab. Many factors have to be considered-high on-time performance, short cycle time and low cost manufacturing. However, there are variable product mixes, lots of products, diversified equipment constraints and specified process requirements in a typical wafer foundry fab. In addition, the operation and safety environment should also be well designed for AGVS. In this paper, our AGVS implementation experience and approach considering the above issues is introduced. Furthermore, the improvement in fab operation through installing this system is shown
  • Keywords
    automatic guided vehicles; integrated circuit manufacture; materials handling; production control; safety; IC foundry fab; SMIF environment; Taiwan Semiconductor Manufacturing Company; automated guided vehicle system; automated guided vehicles system; cycle time; equipment constraints; intrabay system; on-time performance; process requirements; safety environment; variable product mixes; wafer foundry fab; Costs; Foot; Foundries; Manufacturing automation; Manufacturing industries; Materials handling; Safety; Semiconductor device manufacture; Throughput; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Technology Workshop, 1998
  • Conference_Location
    Hsinchu
  • Print_ISBN
    0-7803-5179-7
  • Type

    conf

  • DOI
    10.1109/SMTW.1998.722698
  • Filename
    722698