• DocumentCode
    1911791
  • Title

    Noncontact inspection of opaque film thickness in single layer and multilayer structures and edge-exclusion zones

  • Author

    Banet, M. ; Fuchs, Martin ; Logan, Randy A. ; Nelson, Keith A. ; Rogers, John A.

  • Author_Institution
    Active Impulse Syst., Natick, MA, USA
  • fYear
    1997
  • fDate
    6-8 Oct 1997
  • Abstract
    A rapid, noncontact, nondestructive optical measurement method permits determination of the thicknesses of opaque films with angstrom repeatability. The method, called impulsive stimulated thermal scattering (ISTS), can be used on nearly any metal including Cu, Al, Ti, W, and Ti:W. Measurements are made across the entire area of a wafer including the edge-exclusion zone, permitting examination of beveled layer edges. Exposed and buried metal layers can both be measured. Typical data acquisition time is about one second, suitable for in-line measurement of product wafers. Comparisons of ISTS results with those of conventional four-point probe, SEM, and profilometry measurements are favorable
  • Keywords
    inspection; integrated circuit metallisation; integrated circuit yield; photoacoustic effect; thickness measurement; Al; Cu; Ti; Ti:W; W; angstrom repeatability; beveled layer edges; buried metal layers; edge-exclusion zones; exposed layers; impulsive stimulated thermal scattering; in-line measurement; metal films; multilayer structures; noncontact inspection; nondestructive optical measurement method; opaque film thickness; photoacoustic method; product wafers; single-layer structures; yield enhancement; Acoustic measurements; Acoustic waves; Electrical resistance measurement; Inspection; Monitoring; Nonhomogeneous media; Optical films; Optical scattering; Semiconductor films; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-3752-2
  • Type

    conf

  • DOI
    10.1109/ISSM.1997.664615
  • Filename
    664615