DocumentCode
1912050
Title
Test ASIC for investigation of thermal coupling in Many-Core Architectures
Author
Szermer, Michal ; Maj, Cezary ; Pietrzak, Piotr ; Janicki, Marcin ; Zajac, Piotr ; Napieralski, Andrzej
Author_Institution
Dept. of Microelectron. & Comput. Sci., Tech. Univ. of Lodz, Lodz, Poland
fYear
2012
fDate
18-22 March 2012
Firstpage
135
Lastpage
138
Abstract
This paper presents the design of a test ASIC, which was intended for the investigation of thermal coupling in Many-Core Architectures. Particular sections of the paper describe in detail the design concept and simulated operation of the ASIC which is currently sent for manufacturing.
Keywords
application specific integrated circuits; integrated circuit design; integrated circuit testing; microprocessor chips; multiprocessing systems; thermal management (packaging); design concept; many-core architectures; simulated operation; test ASIC; thermal coupling; Application specific integrated circuits; Computer architecture; Couplings; Heating; Program processors; Temperature measurement; Temperature sensors; Many-Core Architectures; Test ASIC; Thermal Coupling;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-4673-1110-6
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2012.6188839
Filename
6188839
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