DocumentCode
1912132
Title
Metallic contaminants generation from tubing during start-up and following moisture upsets in HCl distribution systems
Author
Anderson, N. ; Vereecke, G. ; Heyns, M.M. ; Espitalier-Noel, P.
Author_Institution
BOC Gases, Leuven, Belgium
fYear
1997
fDate
6-8 Oct 1997
Abstract
Contamination control has always been an important issue for IC manufacturing processes. Within the area of corrosive gas distribution, metallic contamination is a constant threat to process yield. This paper focuses on metallic contamination resulting from low pressure HCl gas flow through tubing materials during system start-up and following exposure to moisture. The paper discusses the effect of HCl exposure on two tubing materials. Data relating to the type, physical state, and concentration of metallic contamination is included. Surface chemistry mechanisms are proposed in relation to the observed phenomena. The comparison of two tubing materials permits performance, cost and design implications to be considered
Keywords
integrated circuit manufacture; materials handling; pollution control; surface contamination; HCl; HCl distribution systems; IC manufacturing processes; contamination control; corrosive gas distribution; cost implications; design implications; low pressure HCl gas flow; metallic contaminants generation; moisture upsets; particle filter; performance; process yield; start-up; surface chemistry mechanisms; tubing; Atomic measurements; Chemistry; Control systems; Corrosion; Fluid flow; Gases; Human computer interaction; Inorganic materials; Moisture; Surface contamination;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-3752-2
Type
conf
DOI
10.1109/ISSM.1997.664629
Filename
664629
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