Design dependency of yield loss due to tungsten residues in spin on glass based planarization processes

Author

Simon, P.L.C. ; Maly, W. ; de Vries, D.K. ; Bruls, E.

Author_Institution

Philips Semiconductors, Nijmegen, Netherlands

fYear

1997

fDate

6-8 Oct 1997

Abstract

In spin on glass (SOG) planarization processes yield loss can occur in between closely spaced metal lines due to the formation of tungsten residues called stringers. Stringers may cause electrical shorts between adjacent metal tracks, In this paper it is shown under what conditions stringers may occur and the extraction procedure capable of detecting locations prone to stringers in a product is proposed. The usefulness of such a procedure for both failure analysis and in line process monitoring is discussed as well

Keywords

design for manufacture; etching; failure analysis; inspection; integrated circuit interconnections; integrated circuit yield; polishing; MAPEX tool; W; closely spaced metal lines; design dependency; design rule checking; electrical shorts; etching parameters; extraction procedure; failure analysis; in line process monitoring; inspection strategy; manufacturability risk extraction; spin on glass based planarization processes; stringers; tungsten residues; yield learning; yield loss; Condition monitoring; Delay; Electronics industry; Etching; Failure analysis; Glass; Manufacturing automation; Planarization; Time to market; Tungsten;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-3752-2

Type

conf

DOI

10.1109/ISSM.1997.664631

Filename

664631