Title :
Advanced techniques for contact module development
Author :
Zika, Steve ; King, Paul L. ; Pak, James
Author_Institution :
Adv. Micro Devices Inc., Sunnyvale, CA, USA
Abstract :
We describe the application of an advanced SEM-based inspection tool (a KLA 2702 “SEMSpec”) during contact module process development. SEMSpec image contrast is derived from surface voltage variations and is particularly well suited to identifying electrical defects within contact chains. Results are presented from a study in which the SEMSpec was effectively used to identify unfilled and partially filled tungsten contacts, many of which were not detectable by standard optical or conventional SEM inspection. SEMSpec images are compared with conventional SEM micrographs (topdown and after FIB cuts). Contrast mechanisms are discussed
Keywords :
electron beam testing; fault diagnosis; inspection; integrated circuit metallisation; integrated circuit testing; scanning electron microscopy; tungsten; SEMSpec image contrast; W; advanced SEM-based inspection tool; contact chains; contact module development; electrical defects; partially filled tungsten contacts; scanning electron beam; surface voltage variations; unfilled tungsten contacts; Contacts; Electron beams; Inspection; Optical detectors; Optical feedback; Optical sensors; Probes; Testing; Tungsten; Voltage;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3752-2
DOI :
10.1109/ISSM.1997.664634
