Advanced techniques for contact module development

Author

Zika, Steve ; King, Paul L. ; Pak, James

Author_Institution

Adv. Micro Devices Inc., Sunnyvale, CA, USA

fYear

1997

fDate

6-8 Oct 1997

Lastpage

101

Abstract

We describe the application of an advanced SEM-based inspection tool (a KLA 2702 “SEMSpec”) during contact module process development. SEMSpec image contrast is derived from surface voltage variations and is particularly well suited to identifying electrical defects within contact chains. Results are presented from a study in which the SEMSpec was effectively used to identify unfilled and partially filled tungsten contacts, many of which were not detectable by standard optical or conventional SEM inspection. SEMSpec images are compared with conventional SEM micrographs (topdown and after FIB cuts). Contrast mechanisms are discussed

Keywords

electron beam testing; fault diagnosis; inspection; integrated circuit metallisation; integrated circuit testing; scanning electron microscopy; tungsten; SEMSpec image contrast; W; advanced SEM-based inspection tool; contact chains; contact module development; electrical defects; partially filled tungsten contacts; scanning electron beam; surface voltage variations; unfilled tungsten contacts; Contacts; Electron beams; Inspection; Optical detectors; Optical feedback; Optical sensors; Probes; Testing; Tungsten; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-3752-2

Type

conf

DOI

10.1109/ISSM.1997.664634

Filename

664634