DocumentCode
1912316
Title
Two-Step Deposition Method for Improvement of the Electrical Characteristics of BST Thin Films
Author
Kil, D. ; Byung-Il Lee ; Joo, Seung-Ki
Author_Institution
Seoul National University, Korea
fYear
1997
fDate
22-24 Sept. 1997
Firstpage
752
Lastpage
755
Abstract
The characteristics of the BST thin films deposited by two-step deposition process were investigated. A 100 Å thick bottom layer was deposited at 600 C° and then upper main layer was in-situ deposited at 350 C° by rf magnetron co-sputtering, respectively. Two-step deposited BST thin film of 500 Å showed lower lealwge current density of 2 X 10-3A/cm2 at 1.5V and more wide flat region in the low field than those of BST thin film deposited by one step process, and small silicon oxide equivalent thickness of 4.9 Å. With the decrease of film thickness, equivalent oxide thickness which is about 5.4 Å for the film with thickness of 1000 A can be reduced to 4.2 Å for 200 Å.
Keywords
Dielectric constant; Dielectric measurements; Dielectric substrates; Dielectric thin films; Electric variables; Leakage current; Semiconductor thin films; Sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference, 1997. Proceeding of the 27th European
Conference_Location
Stuttgart, Germany
Print_ISBN
2-86332-221-4
Type
conf
DOI
10.1109/ESSDERC.1997.194538
Filename
1503468
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