DocumentCode :
1912661
Title :
Process and Design Considerations for Latch-Up Optimization on Deep Sub-Micron CMOS Technology
Author :
Leroux, C. ; Guegan, G. ; Lerme, M.
Author_Institution :
DMEL-CENG, LETI (CEA - Technol. Av.), Grenoble, France
fYear :
1993
fDate :
13-16 Sept. 1993
Firstpage :
197
Lastpage :
200
Abstract :
CMOS latch-up parameters are experimentally studied in the context of deep submicron technology optimization. Holding voltage and triggering current values are measured for both various design rules (N+/P+ distance, structure width) and various process conditions (epitaxial thickness, substrate resistivity, well dose). It is demonstrated that with diffused well, latch-up free behavior can be obtained down to 2 μm N+/P+ distance. This immunity to latch-up is ensured either by a holding voltage greater than power supply voltage or by triggering currents high enough.
Keywords :
CMOS logic circuits; circuit optimisation; flip-flops; CMOS latch-up parameters; deep sub-micron CMOS technology; epitaxial thickness; holding voltage; latch-up optimization; substrate resistivity; triggering current values; well dose; CMOS process; CMOS technology; Conductivity; Current measurement; Design optimization; Power supplies; Process design; Substrates; Thickness measurement; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1993. ESSDERC '93. 23rd European
Conference_Location :
Grenoble
Print_ISBN :
2863321358
Type :
conf
Filename :
5435491
Link To Document :
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