DocumentCode
1912900
Title
The Future of High Density Packaging
Author
Johnson, Barry C.
Author_Institution
Motorola Semicond. Products Sector, Tempe, AZ, USA
fYear
1993
fDate
13-16 Sept. 1993
Firstpage
249
Lastpage
256
Abstract
A general overview is presented of high density packaging methods earmarked for use with future leading edge integrated circuits. Pertinent design, performance and cost factors are compared relative to future circuit requirements.
Keywords
electronics packaging; high density packaging; leading edge integrated circuits; Clocks; Costs; Electronic packaging thermal management; High speed integrated circuits; Integrated circuit interconnections; Integrated circuit packaging; Lead compounds; Pins; Semiconductor device packaging; Signal processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1993. ESSDERC '93. 23rd European
Conference_Location
Grenoble
Print_ISBN
2863321358
Type
conf
Filename
5435500
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