DocumentCode
1912922
Title
Validation of module assembly physical models
Author
Iannuzzelli, R.
Author_Institution
Digital Equipment Corp., Salem, NH
fYear
1990
fDate
20-23 May 1990
Firstpage
1071
Abstract
Some typical models used in the assembly of electronic modules are presented along with data establishing the validity of these models. Six cases are examined: two cases of PTH/PWB (plated-through-hole/printed wiring board) model validation: SMT (surface mount technology) reliability prediction using the matrix creep method; prediction of creep rupture times of SMT butt joints; PGA (pin grid array) cracking; and prediction of PWB deflection during BON (bed-of-nails) testing
Keywords
assembling; circuit reliability; creep fracture; modules; printed circuit testing; surface mount technology; BON; PWB deflection; SMT; butt joints; creep rupture times; electronic modules; matrix creep method; module assembly physical models; pin grid array; plated-through-hole/printed wiring board; reliability prediction; validity; Assembly; Availability; Electric resistance; Electronic equipment manufacture; Electronics packaging; Laminates; Predictive models; Reliability engineering; Testing; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ECTC.1990.122318
Filename
122318
Link To Document