Title :
Package design for high-speed low-cost ASIC LSIs
Author :
Otsuka, Kanji ; Shirai, Yuji ; Miwa, Takashi ; Nakano, Tetsuo ; Yamagiwa, Akira ; Hatada, Toshio ; Tsuboi, Toshihiro
Author_Institution :
Hitachi Ltd., Tokyo, Japan
Abstract :
Cofired alumina ceramic, alumina-based Cu/polyimide thin films, and plastic PGAs (pin-grid-arrays) are compared in terms of electrical and thermal characteristics and cost. Plastic PGA with the cavity down and a three-layer structure is shown to be the best way to meet the requirement of over 50-MHz signal transmission, thermal resistance and cost. The best results on the 592-pin plastic PGA package and its simulation results are described
Keywords :
application specific integrated circuits; ceramics; integrated circuit technology; large scale integration; packaging; polymer films; ASIC LSIs; Al2O3; alumina-based Cu/polyimide thin films; cofired alumina ceramic; cost; electrical characteristics; plastic PGAs; signal transmission; simulation results; thermal characteristics; thermal resistance; Application specific integrated circuits; Copper; Costs; Delay; Electronics packaging; Large scale integration; Pins; Plastic packaging; Thermal resistance; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122319
