• DocumentCode
    1913276
  • Title

    Biosorption equilibrium and kinetics of copper (II) from aqueous solution using dead leaves of plane tree

  • Author

    Gong, Lei ; Zhang, Jin ; Wang, Fulu

  • Author_Institution
    Coll. of Environ. & Safety Eng., Qingdao Univ. of Sci. & Technol., Qingdao, China
  • Volume
    2
  • fYear
    2011
  • fDate
    20-22 May 2011
  • Firstpage
    1519
  • Lastpage
    1523
  • Abstract
    The dead leaves of plane tree were investigated as a low-cost biosorbent for the removal of Cu2+ from aqueous solution in a batch system. Different environmental factors such as initial Cu2+ concentration, contact time, biosorbent dose, temperature and pH were studied. The sorption was found to be maximum in natural medium and increases with increase in initial concentration. Langmuir, Freundlich and Temkin isotherm model were applied to describe the biosorption of the metal ions onto biosorbent. Langmuir and Freundlich model fitted the equilibrium data better than the Temkin isotherm. Modeling of kinetic results shows that sorption process is best described by of the pseudo-second order model. intra-particle diffusion model indicated the adsorption of Cu2+ onto dead leaves is controlled by both external mass transfer and intra-particle diffusion.
  • Keywords
    adsorption; copper; wastewater treatment; Freundlich isotherm model; Langmuir isotherm model; Temkin isotherm model; adsorption; aqueous solution; batch system; biosorbent dose; biosorption equilibrium; copper; dead leaves; environmental factors; intra-particle diffusion model; kinetics; mass transfer; metal ions; plane tree; pseudo-second order model; sorption process; Biological system modeling; Copper; Kinetic theory; Lead; Biosorption; Copper (II); Isotherm; Kinetics; Plane tree leaves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Materials for Renewable Energy & Environment (ICMREE), 2011 International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-61284-749-8
  • Type

    conf

  • DOI
    10.1109/ICMREE.2011.5930622
  • Filename
    5930622