DocumentCode
1913580
Title
p-MOSFETs and MODFETs with a strained Si1-x Gex channel layer
Author
Reader, A.H. ; Colak, S. ; Montree, A.H. ; Kersten, W.J. ; Gravesteijn, D.J.
Author_Institution
Philips Res. Labs., Eindhoven, Netherlands
fYear
1993
fDate
13-16 Sept. 1993
Firstpage
365
Lastpage
368
Abstract
Si1-xGex channel p-MOSFETs and MODFETs containing Ge fractions from x=0 to 1.0 have been fabricated in material grown at 550°C. An improved carrier mobility was recorded for a Si0.8Ge0.2 device over that for a control MOSFET fabricated in Si also grown at this low temperature. It is argued that this growth temperature is responsible for the low absolute values of mobility recorded in these devices.
Keywords
Ge-Si alloys; MOSFET; carrier mobility; high electron mobility transistors; Ge fractions; MODFET; Si1-xGex; carrier mobility; control MOSFET; p-MOSFET; strained channel layer; temperature 550 degC; Annealing; CMOS integrated circuits; Epitaxial layers; HEMTs; MODFETs; MOSFET circuits; Strain control; Substrates; Temperature control; Transconductance;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1993. ESSDERC '93. 23rd European
Conference_Location
Grenoble
Print_ISBN
2863321358
Type
conf
Filename
5435523
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