• DocumentCode
    1913615
  • Title

    Temperature influence on UTBOX 1T-DRAM using GIDL for writing operation

  • Author

    Sasaki, K.R.A. ; Almeida, L.M. ; Martino, J.A. ; Aoulaiche, M. ; Simoen, E. ; Claeys, C.

  • Author_Institution
    LSI, Univ. of Sao Paulo, São Paulo, Brazil
  • fYear
    2012
  • fDate
    14-17 March 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper investigates the temperature influence on Ultra Thin Buried Oxide (UTBOX) FDSOI devices used as a 1T-DRAM (single transistor dynamic random access memory cell) using GIDL (Gate Induced Drain Leakage) for writing operation through numerical simulations. At higher temperatures, it is observed that the memory window varies and the retention time is degraded, when using a standard read. To solve this issue, we suggest the ZTC read, which fixes the state-0 current independently of the temperature. Moreover, considering I0 current as a reference current for the memory cell operation results in improved retention time.
  • Keywords
    DRAM chips; silicon-on-insulator; FDSOI device; GIDL; gate induced drain leakage; memory cell operation; memory window; numerical simulation; retention time; single transistor dynamic random access memory cell; state-0 current; temperature influence; ultra thin buried oxide; writing operation; Current density; Logic gates; Programming; Silicon on insulator technology; Temperature distribution; Temperature sensors; Writing; 1TDRAM; GIDL; UTBOX;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Devices, Circuits and Systems (ICCDCS), 2012 8th International Caribbean Conference on
  • Conference_Location
    Playa del Carmen
  • Print_ISBN
    978-1-4577-1116-9
  • Electronic_ISBN
    978-1-4577-1115-2
  • Type

    conf

  • DOI
    10.1109/ICCDCS.2012.6188903
  • Filename
    6188903