DocumentCode
1913615
Title
Temperature influence on UTBOX 1T-DRAM using GIDL for writing operation
Author
Sasaki, K.R.A. ; Almeida, L.M. ; Martino, J.A. ; Aoulaiche, M. ; Simoen, E. ; Claeys, C.
Author_Institution
LSI, Univ. of Sao Paulo, São Paulo, Brazil
fYear
2012
fDate
14-17 March 2012
Firstpage
1
Lastpage
4
Abstract
This paper investigates the temperature influence on Ultra Thin Buried Oxide (UTBOX) FDSOI devices used as a 1T-DRAM (single transistor dynamic random access memory cell) using GIDL (Gate Induced Drain Leakage) for writing operation through numerical simulations. At higher temperatures, it is observed that the memory window varies and the retention time is degraded, when using a standard read. To solve this issue, we suggest the ZTC read, which fixes the state-0 current independently of the temperature. Moreover, considering I0 current as a reference current for the memory cell operation results in improved retention time.
Keywords
DRAM chips; silicon-on-insulator; FDSOI device; GIDL; gate induced drain leakage; memory cell operation; memory window; numerical simulation; retention time; single transistor dynamic random access memory cell; state-0 current; temperature influence; ultra thin buried oxide; writing operation; Current density; Logic gates; Programming; Silicon on insulator technology; Temperature distribution; Temperature sensors; Writing; 1TDRAM; GIDL; UTBOX;
fLanguage
English
Publisher
ieee
Conference_Titel
Devices, Circuits and Systems (ICCDCS), 2012 8th International Caribbean Conference on
Conference_Location
Playa del Carmen
Print_ISBN
978-1-4577-1116-9
Electronic_ISBN
978-1-4577-1115-2
Type
conf
DOI
10.1109/ICCDCS.2012.6188903
Filename
6188903
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