Title :
Practical, non-invasive optical probing for flip-chip devices
Author :
Dajee, G. ; Goldblatt, N. ; Lundquist, T. ; Kasapi, S. ; Wilsher, K.
Author_Institution :
Schlumberger Probe Syst., San Jose, CA, USA
Abstract :
A new tool for performing picosecond imaging circuit analysis (PICA) is described. The tool has ±15 ps timing accuracy and can be used with a wide variety of testers. The key design decisions in and limitations of this PICA system are outlined. A low noise, low jitter imaging detector is employed to both visualize the emission sources and provide precise timing information. The daunting challenges of weak signals, image stabilization and complex data acquisition have been successfully met. We briefly describe new methodologies and tools that are needed to realize its potential as well as how such a PICA system could be adopted by debug and failure analysis teams
Keywords :
data acquisition; failure analysis; flip-chip devices; image sensors; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; jitter; test equipment; timing; PICA; PICA system; PICA system methodologies; data acquisition; debug analysis; design decisions; emission source visualization; failure analysis; flip-chip devices; image stabilization; low noise/low jitter imaging detector; noninvasive optical probing; picosecond imaging circuit analysis tool; testers; timing accuracy; timing information; Accuracy; Circuit analysis; Circuit noise; Circuit testing; Detectors; Jitter; Optical devices; Optical imaging; Optical noise; Timing;
Conference_Titel :
Test Conference, 2001. Proceedings. International
Conference_Location :
Baltimore, MD
Print_ISBN :
0-7803-7169-0
DOI :
10.1109/TEST.2001.966660
