Practical, non-invasive optical probing for flip-chip devices

Author

Dajee, G. ; Goldblatt, N. ; Lundquist, T. ; Kasapi, S. ; Wilsher, K.

Author_Institution

Schlumberger Probe Syst., San Jose, CA, USA

fYear

2001

fDate

2001

Firstpage

433

Lastpage

442

Abstract

A new tool for performing picosecond imaging circuit analysis (PICA) is described. The tool has ±15 ps timing accuracy and can be used with a wide variety of testers. The key design decisions in and limitations of this PICA system are outlined. A low noise, low jitter imaging detector is employed to both visualize the emission sources and provide precise timing information. The daunting challenges of weak signals, image stabilization and complex data acquisition have been successfully met. We briefly describe new methodologies and tools that are needed to realize its potential as well as how such a PICA system could be adopted by debug and failure analysis teams

Keywords

data acquisition; failure analysis; flip-chip devices; image sensors; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; jitter; test equipment; timing; PICA; PICA system; PICA system methodologies; data acquisition; debug analysis; design decisions; emission source visualization; failure analysis; flip-chip devices; image stabilization; low noise/low jitter imaging detector; noninvasive optical probing; picosecond imaging circuit analysis tool; testers; timing accuracy; timing information; Accuracy; Circuit analysis; Circuit noise; Circuit testing; Detectors; Jitter; Optical devices; Optical imaging; Optical noise; Timing;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 2001. Proceedings. International

Conference_Location

Baltimore, MD

ISSN

1089-3539

Print_ISBN

0-7803-7169-0

Type

conf

DOI

10.1109/TEST.2001.966660

Filename

966660