• DocumentCode
    1914116
  • Title

    Pd-Ge based Ohmic Contacts to InGaAs-InAlAs High Electron Mobility Transistors

  • Author

    Tardy, J. ; Cremillieu, P. ; Leclercq, J.L. ; Rojo-Romeo, P. ; Rochette, F.

  • Author_Institution
    Lab. d´´Electron., Ecole Centrale de Lyon, Ecully, France
  • fYear
    1993
  • fDate
    13-16 Sept. 1993
  • Firstpage
    467
  • Lastpage
    470
  • Abstract
    This paper reports on the use of Pd-Ge-Ag Au for ohmic contacts to InAlAs/InGaAs High Electron Mobility Transistors (HEMTs). After annealing onto a hot plate, specific contact resistance of 1 10-6Ωcm2 and 5 10-7 Ωcm2 for structures having respectively a 5 nm undoped and a 50 nm n+ doped InGaAs cap layer were obtained in a wide temperature range (380°C470°C). No thermal degradation was observed after 100 hours @ 325°C and 24 hours @ 420°C.
  • Keywords
    III-V semiconductors; aluminium compounds; contact resistance; gallium arsenide; germanium alloys; gold alloys; high electron mobility transistors; indium compounds; ohmic contacts; palladium alloys; semiconductor device metallisation; silver alloys; HEMT; Pd-Ge-Ag-Au-InGaAs-InAlAs; annealing; cap layer; contact resistance; high electron mobility transistors; hot plate; ohmic contacts; Annealing; Contact resistance; Gold; HEMTs; Indium compounds; Indium gallium arsenide; MODFETs; Ohmic contacts; Temperature distribution; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1993. ESSDERC '93. 23rd European
  • Conference_Location
    Grenoble
  • Print_ISBN
    2863321358
  • Type

    conf

  • Filename
    5435546