DocumentCode :
191415
Title :
The novel prevention technology of the standing wave by SWC (Standing Wave Canceller) SWC for passive RFID tags in all metallic shelf
Author :
Ashida, Hiroshi ; Ohashi, Yoji
Author_Institution :
Adv. Wireless Technol. Lab., Fujitsu Labs. Ltd., Kawasaki, Japan
fYear :
2014
fDate :
6-9 Oct. 2014
Firstpage :
774
Lastpage :
777
Abstract :
Passive radio frequency identification (RFID) tag systems for the management of objects stored on a metallic shelf have a problem with “dead-spots”. These spots occur in low electric field area of the electromagnetic standing wave, causing degradation of the tag´s readability [3], [4]. In this paper, we present standing wave suppression technology by employing the SWC (Standing Wave Canceller). The SWC is a conductive film or dielectric with reflectance (r), installed at a specific distance (Ls) from the reflecting wall. Thus, a part of the electric field is reflected at the SWC (Efr), while another part (Etr) with phase contrast (φ) penetrates into the SWC and is reflected at the wall. These are synthesized into the total reflection electric field (Er = Efr + Etr) at the SWC. When Efr and Etr are anti-phase with respect to each other, e.g., the SWC is installed at the position Ls = λg/4 (φ = π), Er is reduced and the standing wave is suppressed. Our SWC was able to improve tag readability, eliminating the dead-spot and saving power (4.7 dB) during tag-reading experiments in a metallic shelf.
Keywords :
electric fields; electromagnetic waves; radiofrequency identification; SWC; conductive film; electromagnetic standing wave; low electric field area; metallic shelf; passive RFID tags; passive radio frequency identification tag systems; standing wave canceller; standing wave suppression technology; Dielectrics; Electric fields; Erbium; Films; Mathematical model; Reflectivity; Dead spot; Metallic shelf; RFID; Sanding wave; sanding wave canceller (SWC);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference (EuMC), 2014 44th European
Conference_Location :
Rome
Type :
conf
DOI :
10.1109/EuMC.2014.6986549
Filename :
6986549
Link To Document :
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