• DocumentCode
    1914643
  • Title

    Technological materials for microelectronic production

  • Author

    Smirnov, A.M.

  • Author_Institution
    OSTEC Enterprise Ltd., Moscow
  • fYear
    2008
  • fDate
    24-25 Sept. 2008
  • Firstpage
    429
  • Lastpage
    435
  • Abstract
    This article is about modern technological materials for microelectronic production: die attach adhesives, wire for wire bonding, different sealants for protection of dies.
  • Keywords
    adhesive bonding; integrated circuits; lead bonding; microassembling; seals (stoppers); die attach adhesives; microelectronic production; protection sealants; technological materials; wire bonding; Bonding; Chip scale packaging; Helium; Microassembly; Microelectronics; Modems; Production; Protection; Sealing materials; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Actual Problems of Electron Devices Engineering, 2008. APEDE '08. International Conference on
  • Conference_Location
    Saratov
  • Print_ISBN
    978-1-4244-2121-3
  • Electronic_ISBN
    978-1-4244-2122-0
  • Type

    conf

  • DOI
    10.1109/APEDE.2008.4720186
  • Filename
    4720186
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1914643