DocumentCode :
1914643
Title :
Technological materials for microelectronic production
Author :
Smirnov, A.M.
Author_Institution :
OSTEC Enterprise Ltd., Moscow
fYear :
2008
fDate :
24-25 Sept. 2008
Firstpage :
429
Lastpage :
435
Abstract :
This article is about modern technological materials for microelectronic production: die attach adhesives, wire for wire bonding, different sealants for protection of dies.
Keywords :
adhesive bonding; integrated circuits; lead bonding; microassembling; seals (stoppers); die attach adhesives; microelectronic production; protection sealants; technological materials; wire bonding; Bonding; Chip scale packaging; Helium; Microassembly; Microelectronics; Modems; Production; Protection; Sealing materials; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Actual Problems of Electron Devices Engineering, 2008. APEDE '08. International Conference on
Conference_Location :
Saratov
Print_ISBN :
978-1-4244-2121-3
Electronic_ISBN :
978-1-4244-2122-0
Type :
conf
DOI :
10.1109/APEDE.2008.4720186
Filename :
4720186
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1914643
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