Title :
Load Pull Analysis of SiGe Power HBTs for Mobile Communication Systems
Author :
Seiler, U. ; Dietrich, H. ; Schüppen, A.
Author_Institution :
TEMIC Semiconductor GmbH, Heilbronn, Germany
Conference_Titel :
Solid-State Device Research Conference, 1998. Proceeding of the 28th European
Conference_Location :
Bordeaux, France
Print_ISBN :
2-86332-234-6
