Title :
Electrical Performances of a Mounted Chip in a Plastic Package
Author :
Ndagijimana, F. ; Cabon, B. ; Chilo, J.
Author_Institution :
Lab. d´´Electromagn. Microondes et Optoelectron., Grenoble, France
Abstract :
An electrical modelling concept for high speed packages (f<;5 GHz) is proposed. Using an equivalent circuit of an assembled SO8 package, electrical performances are simulated. It is shown that the inductive path between the gound plane of the die and the main ground plane constitute a severe limitation at high frequency. Our modelling concept is applicable to any single chip package.
Keywords :
assembling; equivalent circuits; integrated circuit packaging; plastic packaging; surface mount technology; assembled S08 package; die gound plane; electrical modelling concept; equivalent circuit; high speed plastic package; inductive path; mounted chip electrical performance; single chip package; surface mount technology; Assembly; Equivalent circuits; Frequency; Inductance; Joining processes; Moment methods; Plastic packaging; Strips; Surface-mount technology; Switches;
Conference_Titel :
Solid State Device Research Conference, 1993. ESSDERC '93. 23rd European
Conference_Location :
Grenoble
