Title :
Advances in military hybrids
Author_Institution :
Vitarel Mroelectronic., San Diego, CA, USA
Abstract :
The author discusses changes in the requirements and specifications of military hybrids, some of the changes occurring in their design, and some of the newer materials and techniques used in their manufacture. Particular attention is given to the computer-aided design of hybrids, substrate materials, thick-film materials and processes, thin-film materials and processes, the tape-transfer process, and assembly processes
Keywords :
circuit CAD; hybrid integrated circuits; integrated circuit manufacture; military equipment; packaging; substrates; assembly processes; computer-aided design; dense packaging; military hybrids; substrate materials; tape-transfer process; thick-film materials; thin-film materials; CMOS technology; Certification; Hybrid integrated circuits; Integrated circuit technology; Manufacturing processes; Microelectronics; Military standards; Qualifications; Space technology; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122329
