DocumentCode :
1915819
Title :
A new test/diagnosis/rework model for use in technical cost modeling of electronic systems assembly
Author :
Trichy, Thiagarajan ; Sandborn, Peter ; Raghavan, Ravi ; Sahasrabudhe, Shubhada
Author_Institution :
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
fYear :
2001
fDate :
2001
Firstpage :
1108
Lastpage :
1117
Abstract :
This paper presents a test/diagnosis/rework analysis model for use in technical cost modeling of electronic assemblies. The approach includes a model of test operations characterized by fault coverage, false positives, and defects introduced in test, in addition to rework and diagnosis operations that have variable success rates and their own defect introduction mechanisms. The model can accommodate an arbitrary number of rework attempts on any given assembly and can be used to optimize the fault coverage and rework investment during system tradeoff analyses. The model´s implementation allows all inputs to the model to be represented as probability distributions thereby accommodating inevitable uncertainties in input data present during tradeoff activities and uses Monte Carlo methods to determine model outputs
Keywords :
Monte Carlo methods; assembling; costing; economics; electronic equipment manufacture; electronic equipment testing; fault diagnosis; modelling; probability; production testing; Monte Carlo methods; defect introduction mechanisms; defects; electronic assemblies; electronic systems assembly; false positives; fault coverage; probability distributions; rework investment; system tradeoff analyses; technical cost modeling; test operations; test/diagnosis/rework analysis model; Assembly systems; Cost function; Educational institutions; Electronic equipment testing; Fault diagnosis; Investments; Manufacturing; Probability distribution; System testing; Uncertainty;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 2001. Proceedings. International
Conference_Location :
Baltimore, MD
ISSN :
1089-3539
Print_ISBN :
0-7803-7169-0
Type :
conf
DOI :
10.1109/TEST.2001.966737
Filename :
966737
Link To Document :
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