Title :
Three-dimensional MMIC technology for multifunction integration and its possible application to masterslice MMIC
Author :
Tokumitsu, T. ; Nishikawa, K. ; Kamogawa, K. ; Toyoda, I. ; Aikawa, M.
Author_Institution :
Wireless Systems Labs., NTT, Kanagawa, Japan
Abstract :
We first verified that the integration level of multifunction MMICs can be easily increased three-fold by using three-dimensional (3-D) MMIC structure, in comparison to planar ones. The technology was used to build high-density masterslice MMICs on a single footprint in 2/spl times/2 mm by incorporating two levels of ground metals in the 3-D structure.
Keywords :
MMIC; MMIC amplifiers; integrated circuit technology; 3D MMIC technology; X-band receiver; high-density masterslice MMIC; multifunction integration; three-dimensional MMIC structure; Broadband amplifiers; Circuits; FETs; Frequency; Gallium arsenide; Laboratories; MMICs; Microwave amplifiers; Polyimides; Satellite broadcasting;
Conference_Titel :
Microwave and Millimeter-Wave Monolithic Circuits Symposium, 1996. Digest of Papers., IEEE 1996
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-3360-8
DOI :
10.1109/MCS.1996.506309
