DocumentCode :
1916472
Title :
Facet machining of silica waveguides with nanoscale roughness without polishing or lapping
Author :
Carpenter, L.G. ; Rogers, H.L. ; Holmes, Christopher ; Gates, James C. ; Smith, Peter G. R.
Author_Institution :
Optoelectron. Res. Centre, Univ. of Southampton, Southampton, UK
fYear :
2013
fDate :
12-16 May 2013
Firstpage :
1
Lastpage :
1
Abstract :
Summary form only given. To achieve low-loss free space coupling for integrated optics, device facets need to be smooth, free of chips and flat. The typical route for accomplishing these requirements is by traditional lapping and polishing. We report that high quality optical quality facets with a S<;sub>a<;/sub> = 4.9 nm can be machined using a simple dicing technique. In order to directly measure the scatter loss a device with a series of Bragg gratings is used to characterise the average interface loss per facet.Traditional lapping and polishing of planar integrated optics is time consuming due to the multiple tasks required to perform the process, i.e. sample stacking and bonding, plate preparation, which all require constant human attention to ensure good facet quality. Created for the semiconductor industry, precision dicing saws are normally used to separate ICs from wafers but can be used to dice optical grade surfaces into materials such as silica. Dicing has been used to create such photonic structures as silica microcantilevers [1], multimode interference devices in silica flat fibre [2] and waveguides in lithium niobate [3]. Compared to traditional techniques, dicing offers automated wafer scale facet preparation requiring seconds to machine each facet. We optimised dicing machining parameters to obtain optical quality facets in flame hydrolysis deposition silica-on-silicon. We focused on changing the feed rate and blade rotational speed while keeping constant the blade type (i.e. diamond size, diamond concentration and diamond bond type) and depth of cut. The diced silica surface roughness was analysed using a white light interferometer (Zemetrics, ZeScope). The smoothest silica facets produced had a three dimensional (areal), average surface (Sa) of 4.9 nm, as shown in Fig. 1 a). The optimised machining parameters for machining smooth silica facets, was found to be <;0.4 μm/rev using a diamond impregnated nickel bonded blad- .
Keywords :
Bragg gratings; cantilevers; light interferometry; lithium compounds; machining; micro-optics; optical fabrication; optical loss measurement; optical planar waveguides; polishing; silicon compounds; surface roughness; Bragg gratings; IC separation; LiNbO3; SiO2; automated wafer scale facet preparation; average interface loss; blade rotational speed; blade type; bonding; cut depth; device facets; diamond bond type; diamond concentration; diamond impregnated nickel bonded blade; diamond size; diced silica surface roughness; feed rate; flame hydrolysis deposition silica-on-silicon; high quality optical quality facets; lithium niobate; low-loss free space coupling; multimode interference devices; nanoscale roughness; optical grade surfaces; optimised dicing machining parameters; optimised machining parameters; photonic structures; planar integrated optics; plate preparation; precision dicing saws; scatter loss; semiconductor industry; silica flat fibre; silica microcantilevers; silica waveguide; simple dicing technique; size 4.9 nm; smooth silica facet machining; stacking; traditional lapping; traditional polishing; white light interferometer; Bragg gratings; Integrated optics; Loss measurement; Machining; Optical interferometry; Optical waveguides; Silicon compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics Europe (CLEO EUROPE/IQEC), 2013 Conference on and International Quantum Electronics Conference
Conference_Location :
Munich
Print_ISBN :
978-1-4799-0593-5
Type :
conf
DOI :
10.1109/CLEOE-IQEC.2013.6800986
Filename :
6800986
Link To Document :
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