Title :
Incorporation of Equipment Simulation into Integrated Feature Scale Profile Evolution
Author :
Pyka, W. ; Selberherr, S. ; Sukharev, V.
Author_Institution :
Vienna University of Technology, Austria
fDate :
11-13 September 2000
Keywords :
Adhesives; Atherosclerosis; Conductivity; Distribution functions; Inductors; Large scale integration; Logic; Microelectronics; Protection; Sputtering;
Conference_Titel :
Solid-State Device Research Conference, 2000. Proceeding of the 30th European
Print_ISBN :
2-86332-248-6
DOI :
10.1109/ESSDERC.2000.194744
