• DocumentCode
    1917774
  • Title

    Substrate noise in mixed signal circuits: two case studies [CMOS]

  • Author

    England, David

  • Author_Institution
    Intel Corp., Chandler, AZ, USA
  • fYear
    1998
  • fDate
    13-16 Sep 1998
  • Firstpage
    37
  • Lastpage
    41
  • Abstract
    There are many noise sources in integrated circuits that can affect sensitive analog nodes. The role of substrate noise is often glossed over since the designer `knows´ that guard rings and separation of the analog section from digital circuits should take care of the noise. However, with smaller geometries now being the norm, it is increasingly difficult to isolate analog nodes from noise induced on the substrate. Also, package economics have introduced other factors that weigh heavily against the analog designer. This paper explores two cases of noise induced on the substrate affecting operation of analog circuits
  • Keywords
    CMOS integrated circuits; integrated circuit design; integrated circuit noise; integrated circuit packaging; mixed analogue-digital integrated circuits; CMOS; analog design; guard rings; mixed signal circuits; noise sources; package economics; sensitive analog nodes; substrate noise; Circuit noise; Computer aided software engineering; Integrated circuit noise; Noise figure; Noise reduction; Packaging; Pins; Semiconductor device modeling; Substrates; Surface impedance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC Conference 1998. Proceedings. Eleventh Annual IEEE International
  • Conference_Location
    Rochester, NY
  • ISSN
    1063-0988
  • Print_ISBN
    0-7803-4980-6
  • Type

    conf

  • DOI
    10.1109/ASIC.1998.722799
  • Filename
    722799