DocumentCode
1917774
Title
Substrate noise in mixed signal circuits: two case studies [CMOS]
Author
England, David
Author_Institution
Intel Corp., Chandler, AZ, USA
fYear
1998
fDate
13-16 Sep 1998
Firstpage
37
Lastpage
41
Abstract
There are many noise sources in integrated circuits that can affect sensitive analog nodes. The role of substrate noise is often glossed over since the designer `knows´ that guard rings and separation of the analog section from digital circuits should take care of the noise. However, with smaller geometries now being the norm, it is increasingly difficult to isolate analog nodes from noise induced on the substrate. Also, package economics have introduced other factors that weigh heavily against the analog designer. This paper explores two cases of noise induced on the substrate affecting operation of analog circuits
Keywords
CMOS integrated circuits; integrated circuit design; integrated circuit noise; integrated circuit packaging; mixed analogue-digital integrated circuits; CMOS; analog design; guard rings; mixed signal circuits; noise sources; package economics; sensitive analog nodes; substrate noise; Circuit noise; Computer aided software engineering; Integrated circuit noise; Noise figure; Noise reduction; Packaging; Pins; Semiconductor device modeling; Substrates; Surface impedance;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC Conference 1998. Proceedings. Eleventh Annual IEEE International
Conference_Location
Rochester, NY
ISSN
1063-0988
Print_ISBN
0-7803-4980-6
Type
conf
DOI
10.1109/ASIC.1998.722799
Filename
722799
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