How far can we go in wireless testing of memory chips and wafers?

Author

Wu, Cheng-Wen

Author_Institution

Nat. Taiwan Univ., Taipei

fYear

2007

fDate

3-5 Dec. 2007

Firstpage

31

Lastpage

32

Abstract

Summary form only given. Test cost has become a significant portion of the cost structure in advanced semiconductor memory products. To address this issue at both the wafer and packaged-chip levels, we propose HOY - a novel wireless test system with enhanced embedded test features. In this talk we will briefly outline Project HOY and the test systems and applications it defines, with focus on memory chips and wafers. Our vision is that high-end memory IC testing can go wireless in a few years. Therefore, HOY is intended as a next-generation memory test system, with wireless communication and enhanced embedded test features, such as built-in self test (BIST) and built-in self-repair (BISR).

Keywords

built-in self test; integrated circuit testing; memory architecture; HOY wireless test system; advanced semiconductor memory products; built-in self test; built-in self-repair; embedded test features; memory IC testing; memory chips; packaged-chip levels; test cost; wafers; wireless communication; wireless testing; Automatic testing; Built-in self-test; Circuit testing; Computer Society; Conferences; Costs; Electronic equipment testing; Life members; System testing; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Memory Technology, Design and Testing, 2007. MTDT 2007. IEEE International Workshop on

Conference_Location

Taipei

ISSN

1087-4852

Print_ISBN

978-1-4244-1656-1

Electronic_ISBN

1087-4852

Type

conf

DOI

10.1109/MTDT.2007.4547611

Filename

4547611