Title :
Current Capabilities/needs and future possibilities of multi-Chip-modules Summary
Author_Institution :
University of Utah
Keywords :
Assembly; Costs; Dielectric substrates; Packaging; Production; Silicon; Testing; Thermal expansion; Thermal management; Wiring;
Conference_Titel :
Device Research Conference, 1991. 49th Annual
Conference_Location :
Boulder, CO, USA
Print_ISBN :
0-87942-647-0
DOI :
10.1109/DRC.1991.664663
