Title :
Electro-Thermo-Mechanical Field Analysis using SESES
Author :
Funk, J. ; Korvink, J.G. ; Wachutka, G. ; Baltes, H.
Author_Institution :
Physical Electronics Laboratory, ETH-Hönggerberg, CH-8093 Zurich
Abstract :
We describe our simulation framework for coupled electro-thermo-mechanical (ETM) analysis of miniaturized transducers and electronic devices. The package is tailored to the specific requirements of micro-electro-mechanical structure design. It achieves high computational accuracy and performance on engineering workstations through the use of an automatic mesh adaptation algorithm [1]. A zone-coupling scheme allows for a considerable reduction of degrees of freedom (Dofs). A fast linear solver coupled with near-optimal finite element data structures enables the solution of complex devices with up to 100,000 finite elements on a workstation.
Keywords :
Analytical models; Computational modeling; Electrostatics; Equations; Finite element methods; Piezoelectric materials; Shape; Tensile stress; Thermal stresses; Workstations;
Conference_Titel :
Solid State Device Research Conference, 1994. ESSDERC '94. 24th European
Conference_Location :
Edinburgh, Scotland