DocumentCode
1919039
Title
Improving Three-Dimensional Semiconductor Modeling through Layout and Process Flow Analysis
Author
Westermann, M. ; Regli, P. ; Strecker, N. ; Fichtner, W.
Author_Institution
Integrated Systems Laboratory, Swiss Fed. Inst. of Technology, CH-8092 Zurich
fYear
1994
fDate
11-15 Sept. 1994
Firstpage
351
Lastpage
354
Abstract
Constructive Solid Geometry (CSG) is a solid modeling technique widely used for the design of semiconductor devices. With the simulation domain subdivision algorithm presented in this paper, the minimal number of solid modeling operations is required in order to build a three-dimensional (3D) device structure. The algorithm is based on a drawing method which combines information on photolithographic masks into a color raster. In this way, solid modeling operations are performed only once on regions having the same color.
Keywords
Buildings; Composite materials; Computational modeling; Data structures; Etching; Geometry; Laboratories; Ligaments; Semiconductor devices; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1994. ESSDERC '94. 24th European
Conference_Location
Edinburgh, Scotland
Print_ISBN
0863321579
Type
conf
Filename
5435734
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