• DocumentCode
    1919039
  • Title

    Improving Three-Dimensional Semiconductor Modeling through Layout and Process Flow Analysis

  • Author

    Westermann, M. ; Regli, P. ; Strecker, N. ; Fichtner, W.

  • Author_Institution
    Integrated Systems Laboratory, Swiss Fed. Inst. of Technology, CH-8092 Zurich
  • fYear
    1994
  • fDate
    11-15 Sept. 1994
  • Firstpage
    351
  • Lastpage
    354
  • Abstract
    Constructive Solid Geometry (CSG) is a solid modeling technique widely used for the design of semiconductor devices. With the simulation domain subdivision algorithm presented in this paper, the minimal number of solid modeling operations is required in order to build a three-dimensional (3D) device structure. The algorithm is based on a drawing method which combines information on photolithographic masks into a color raster. In this way, solid modeling operations are performed only once on regions having the same color.
  • Keywords
    Buildings; Composite materials; Computational modeling; Data structures; Etching; Geometry; Laboratories; Ligaments; Semiconductor devices; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1994. ESSDERC '94. 24th European
  • Conference_Location
    Edinburgh, Scotland
  • Print_ISBN
    0863321579
  • Type

    conf

  • Filename
    5435734