Title :
Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068)
Abstract :
The following topics were dealt with: advanced cooling devices; simulation in thermal management; package thermal performance; materials in electronic cooling; package thermal transients; heat sinks
Keywords :
semiconductor device measurement; semiconductor device packaging; thermal management (packaging); thermal variables measurement; electronic cooling; heat sinks; semiconductor device packaging; thermal management; thermal measurement;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-5916-X
DOI :
10.1109/STHERM.2000.837054
