High efficiency active cooling system

Author

Dziurdzia, Piotr ; Kos, Andrzej

Author_Institution

Inst. of Electron., Krakow, Poland

fYear

2000

fDate

2000

Firstpage

19

Lastpage

26

Abstract

In this paper we present a new method of active cooling of microstructures. The method consists in controlling the active heat sink in relation to the dissipated power in the microstructure and a thermal model of the package. We intend to design an on-chip controller as an ASIC cell. The cell could be placed on the same silicon substrate together with a requiring cooling structure. A special silicon current sensor was designed to estimate the dissipated power in the structure. Simulation results of the active cooling with a new method are presented as well as a design of current sensor

Keywords

Peltier effect; application specific integrated circuits; circuit simulation; controllers; cooling; electric sensing devices; equivalent circuits; heat pumps; heat sinks; integrated circuit packaging; power integrated circuits; temperature control; thermal management (packaging); thermoelectric devices; ASIC cell; IC package; Peltier pump; active cooling system; active heat sink; dissipated power; electrothermal macromodel; equivalent circuit; high efficiency; microstructures cooling; on-chip controller; silicon current sensor; thermal model; thermoelectric modules; Automated highways; Electronics cooling; Feedback loop; Heat sinks; Microstructure; Packaging; Power supplies; Silicon; Temperature control; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE

Conference_Location

San Jose, CA

Print_ISBN

0-7803-5916-X

Type

conf

DOI

10.1109/STHERM.2000.837057

Filename

837057