Title :
Thermal behavior of solder bonded and adhesive bonded folded fin assemblies
Author :
Loh, C.K. ; Chou, Bor-Bin ; Nelson, Dun ; Chou, D.J.
Author_Institution :
Enertron Inc., Mesa, AZ, USA
Abstract :
The rapid advancement in technology of microprocessors has lead electronics thermal system designers to pay increased attention to the folded fin heat sink. The advantages of folded fin heat sinks are lightweight, low profile, and small footprint. This paper presents the theoretical study of thermal contact resistance of different types of bonding at the joint between the folded fin base and the spreader plate of the heat sink, and also the effect of fin thickness on overall thermal resistance. Experimental work is carried out to validate this theoretical analysis
Keywords :
adhesion; cooling; heat sinks; soldering; thermal management (packaging); thermal resistance; adhesive bonded; fin thickness effect; folded fin assemblies; folded fin base; folded fin heat sink; forced convection; overall thermal resistance; solder bonded; spreader plate; thermal contact resistance; thermal system design; Aluminum; Assembly; Bonding; Heat sinks; Heat transfer; Resistance heating; Temperature; Thermal conductivity; Thermal management; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-5916-X
DOI :
10.1109/STHERM.2000.837059
