• DocumentCode
    1919282
  • Title

    Design of a coldplate using Flow Network Modeling (FNM)

  • Author

    Yeh, Joseph J. ; Short, B. Elliott, Jr.

  • Author_Institution
    Electron. Syst., Raytheon, Plano, TX, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    80
  • Lastpage
    85
  • Abstract
    The present study describes the technique of Flow Network Modeling (FNM) and its application for the design of a coldplate. The technique of FNM involves representation of the overall flow system as a network of flow paths and flow components. It employs overall component characteristics solving momentum, mass, and energy conservation equations to predict system-wide fluid flow and temperature distributions. In addition, the use of empirical data and correlations for the flow component characteristics ensures good accuracy of the results. Experimental data from exit flow velocities show that the results from FNM are within approximately 20% of laboratory tests. Unlike other modeling techniques, the amount of time and effort required to create models and solve the problems is relatively low. Simplicity and ease-of-use make the FNM attractive in solving complicated flow systems. This ability to rapidly create and evaluate designs early in the design stage enables the quick development of a good system design
  • Keywords
    cooling; electronic engineering computing; finite volume methods; flow simulation; heat sinks; temperature distribution; thermal management (packaging); MacroFlow software; coldplate design; energy conservation equations; flow components; flow distribution; flow network modeling; flow paths; mass conservation equations; momentum conservation equations; pressure drop; temperature distribution; Computational fluid dynamics; Electronics cooling; Energy conservation; Equations; Fluid flow; Laboratories; Power system modeling; Power system reliability; Temperature distribution; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-5916-X
  • Type

    conf

  • DOI
    10.1109/STHERM.2000.837065
  • Filename
    837065