Algorithmic extension of thermal field solvers: time constant analysis

Author

Székely, V. ; Poppe, A. ; Rencz, M.

Author_Institution

Dept. of Electron Devices, Tech. Univ. Budapest, Hungary

fYear

2000

fDate

2000

Firstpage

99

Lastpage

107

Abstract

The time-constant spectrum representation is a useful description of the dynamic thermal behavior of packages, assemblies and microsystems. The paper presents the idea of the time constant spectrum representation of microelectronic structures, and provides an algorithm that can be used for time constant spectrum calculation in thermal simulator programs. Simulation examples demonstrate the applicability of the method

Keywords

circuit simulation; convolution; function approximation; integrated circuit packaging; lumped parameter networks; micromechanical devices; step response; thermal management (packaging); thermal resistance; time-domain analysis; transient response; IC package; PCB; algorithmic extension; assemblies; complex thermal impedance; dynamic thermal behavior; integral function; lumped circuit; micro-membrane; microelectronic structures; microsystems; packages; thermal field solvers; thermal simulator programs; time constant analysis; time-constant spectrum representation; Algorithm design and analysis; Assembly; Capacitance; Circuits; Convolution; Electron devices; Impedance; Microelectronics; Packaging; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE

Conference_Location

San Jose, CA

Print_ISBN

0-7803-5916-X

Type

conf

DOI

10.1109/STHERM.2000.837068

Filename

837068