• DocumentCode
    1919483
  • Title

    Development of the JEDEC forced convection standard

  • Author

    Claassen, Alan ; Joiner, Bennett ; Celik, Zeki ; Ortega, Alfonso

  • Author_Institution
    IBM Corp., San Jose, CA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    116
  • Lastpage
    127
  • Abstract
    The JEDEC JC15.1 committee is developing standards defining the thermal characterization of integrated circuit devices. A forced convection standard, JEDEC JESD51-6, has been published which defines the measurement of the junction-to-moving-air thermal resistance, θJMA or Theta JMA. This paper documents the key work that was done to develop and validate the forced convection standard. A round robin test was conducted involving two sets of test devices. Results were more consistent than expected. Wind tunnel size requirements were further investigated using a computational fluid dynamics (CFD) study. Altitude considerations are discussed. Consistent results can be obtained at different altitudes using a mass flow type anemometer. Round robin results for thermal characterization parameters ΨJT and ΨJB are also included
  • Keywords
    anemometers; computational fluid dynamics; cooling; forced convection; integrated circuit packaging; standards; thermal resistance; wind tunnels; JEDEC JC15.1 committee; JEDEC JESD51-6; JEDEC forced convection standard; altitude considerations; computational fluid dynamics; junction-to-moving-air thermal resistance; mass flow type anemometer; round robin test; thermal characterization; wind tunnel size requirements; Computational fluid dynamics; Electrical resistance measurement; Force measurement; Integrated circuit measurements; Measurement standards; Round robin; Standards development; Standards publication; Thermal force; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-5916-X
  • Type

    conf

  • DOI
    10.1109/STHERM.2000.837074
  • Filename
    837074