DocumentCode :
1919483
Title :
Development of the JEDEC forced convection standard
Author :
Claassen, Alan ; Joiner, Bennett ; Celik, Zeki ; Ortega, Alfonso
Author_Institution :
IBM Corp., San Jose, CA, USA
fYear :
2000
fDate :
2000
Firstpage :
116
Lastpage :
127
Abstract :
The JEDEC JC15.1 committee is developing standards defining the thermal characterization of integrated circuit devices. A forced convection standard, JEDEC JESD51-6, has been published which defines the measurement of the junction-to-moving-air thermal resistance, θJMA or Theta JMA. This paper documents the key work that was done to develop and validate the forced convection standard. A round robin test was conducted involving two sets of test devices. Results were more consistent than expected. Wind tunnel size requirements were further investigated using a computational fluid dynamics (CFD) study. Altitude considerations are discussed. Consistent results can be obtained at different altitudes using a mass flow type anemometer. Round robin results for thermal characterization parameters ΨJT and ΨJB are also included
Keywords :
anemometers; computational fluid dynamics; cooling; forced convection; integrated circuit packaging; standards; thermal resistance; wind tunnels; JEDEC JC15.1 committee; JEDEC JESD51-6; JEDEC forced convection standard; altitude considerations; computational fluid dynamics; junction-to-moving-air thermal resistance; mass flow type anemometer; round robin test; thermal characterization; wind tunnel size requirements; Computational fluid dynamics; Electrical resistance measurement; Force measurement; Integrated circuit measurements; Measurement standards; Round robin; Standards development; Standards publication; Thermal force; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-5916-X
Type :
conf
DOI :
10.1109/STHERM.2000.837074
Filename :
837074
Link To Document :
بازگشت