DocumentCode
1919483
Title
Development of the JEDEC forced convection standard
Author
Claassen, Alan ; Joiner, Bennett ; Celik, Zeki ; Ortega, Alfonso
Author_Institution
IBM Corp., San Jose, CA, USA
fYear
2000
fDate
2000
Firstpage
116
Lastpage
127
Abstract
The JEDEC JC15.1 committee is developing standards defining the thermal characterization of integrated circuit devices. A forced convection standard, JEDEC JESD51-6, has been published which defines the measurement of the junction-to-moving-air thermal resistance, θJMA or Theta JMA. This paper documents the key work that was done to develop and validate the forced convection standard. A round robin test was conducted involving two sets of test devices. Results were more consistent than expected. Wind tunnel size requirements were further investigated using a computational fluid dynamics (CFD) study. Altitude considerations are discussed. Consistent results can be obtained at different altitudes using a mass flow type anemometer. Round robin results for thermal characterization parameters ΨJT and ΨJB are also included
Keywords
anemometers; computational fluid dynamics; cooling; forced convection; integrated circuit packaging; standards; thermal resistance; wind tunnels; JEDEC JC15.1 committee; JEDEC JESD51-6; JEDEC forced convection standard; altitude considerations; computational fluid dynamics; junction-to-moving-air thermal resistance; mass flow type anemometer; round robin test; thermal characterization; wind tunnel size requirements; Computational fluid dynamics; Electrical resistance measurement; Force measurement; Integrated circuit measurements; Measurement standards; Round robin; Standards development; Standards publication; Thermal force; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE
Conference_Location
San Jose, CA
Print_ISBN
0-7803-5916-X
Type
conf
DOI
10.1109/STHERM.2000.837074
Filename
837074
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